MoldFlow
The warpage analysis is recommended to best understand the molding effects on the resin
and part geometry before production begins. Our CAE team will identify the potential causes
of warpage; differential shrinkage, differential cooling and/or orientation of fibers in the
molded part. Our state-of-the-art software will analyze the part and predict the cause, extent
and direction of the warpage. This will permit you to correct the part and tool design before
manufacturing begins.
◊ Measures Part Deflection
◊ Differential Cooling
◊ Differential Shrinkage
◊ All Effects
◊ Orientation Effects
Warpage is caused by variation in shrinkage;
◊ From region to region within part
◊ Through part thickness differences
◊ Parallel and Perpendicular to the direction of material orientation